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The Descartes Systems Group Inc. (commonly referred to as Descartes) is a Canadian multinational technology company specializing in logistics software, supply chain management software, and cloud -based services for logistics businesses. Descartes is perhaps best known for its abrupt and unexpected turnaround in the mid-2000s after coming close ...
The following is a list of publicly traded companies having the greatest market capitalization.In the global business media, they are described as being the world's most valuable companies as a reference to their market value.
It separated on 11 September 2022 from DART by being ejected at roughly 4 km/h (1.1 m/s; 2.5 mph) relative to DART, 15 days before impact. After release, as part of the testing process to calibrate the miniature spacecraft and its cameras, LICIACube captured images of a crescent Earth and the Pleiades star cluster , also known as the Seven Sisters.
Route assignment, route choice, or traffic assignment concerns the selection of routes (alternatively called paths) between origins and destinations in transportation networks. It is the fourth step in the conventional transportation forecasting model, following trip generation, trip distribution, and mode choice. The zonal interchange analysis ...
The Kraft Group, LLC, is a group of privately held companies in the professional sports, manufacturing, and real estate development industries doing business in 90 countries. [3] Founded in 1998 by American businessman Robert Kraft as a holding company for various interests he had acquired since 1968, [2] it is based in Foxborough, Massachusetts.
The University of Nebraska–Lincoln College of Engineering is the engineering college at the University of Nebraska–Lincoln (NU) in Lincoln, Nebraska. NU has offered engineering classes since 1877 and the College of Engineering was formally established in 1909. Since 1970, it has also encompassed the engineering students and facilities at ...
The 3D IC is one of several 3D integration schemes that exploit the z-direction to achieve electrical performance benefits in microelectronics and nanoelectronics . 3D integrated circuits can be classified by their level of interconnect hierarchy at the global ( package ), intermediate (bond pad) and local ( transistor) level. [2] In general ...