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Windows XP Starter is a low-cost version of Windows XP for developing countries, with limited features and hardware compatibility. It is similar to Windows XP Home, but has some special settings and help options for first-time desktop PC users.
Windows XP is a major release of Microsoft's Windows NT operating system, released in 2001 and succeeded by Windows Vista in 2007. It received critical acclaim for its performance, stability, user interface, and multimedia features, but also faced criticism for its security issues and support lifecycle.
Learn about the history, eligibility, benefits, and administration of CHIP, a federal-state partnership that provides health insurance to low-income families with children. Find out how CHIP evolved from the failed comprehensive health care reform proposals and how it has improved access and health outcomes for millions of children.
Learn about the various types of packages for integrated circuits, such as through-hole, surface mount, chip carrier, pin grid arrays, flat packages, small outline packages and more. Find the acronyms, full names and remarks for each package type, including SOIC (small outline integrated circuit).
A system in a package (SiP) is a number of integrated circuits enclosed in one chip carrier package or substrate that performs the functions of an entire system. Learn about the technology, benefits, applications, suppliers and related terms of SiP from Wikipedia.
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Learn about the components and features of the PlayStation 3 (PS3) video game console, such as the Cell CPU, the RSX GPU, and the PS2 compatibility. Compare the different models and revisions of the PS3, from the original 60 GB to the latest 500 GB Super Slim.
Wafer-level packaging (WLP) is a process of attaching packaging components to an integrated circuit (IC) before dicing. WLP can be a true chip-scale package (CSP) technology, such as wafer-level chip scale packaging (WL-CSP), which has a redistribution layer (RDL) to rearrange the pins or contacts on the die.